Část výrobce | XCZU4EV-1FBVB900I |
---|---|
Výrobce | Xilinx |
Popis | IC SOC CORTEX-A53 900FCBGA |
Kategorie | integrované obvody |
Rodina | vestavěný - systém na čipu (soc) |
Životní cyklus: | New from this manufacturer. |
Dodávka: | DHL FedEx Ups TNT EMS |
Způsob platby | T/T Paypal Visa MoneyGram Western Union |
DataSheet | XCZU4EV-1FBVB900I PDF |
Na skladě | 990 268 |
---|---|
Jednotková cena | $ 1679.60000 |
XCZU4EV-1FBVB900I Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]
Typ | Popis |
---|---|
série: | Zynq® UltraScale+™ MPSoC EV |
balík: | Tray |
stav dílu: | Active |
architektura: | MCU, FPGA |
jádrový procesor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
velikost blesku: | - |
velikost berana: | 256KB |
periferie: | DMA, WDT |
konektivitu: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Rychlost: | 500MHz, 600MHz, 1.2GHz |
primární atributy: | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Provozní teplota: | -40°C ~ 100°C (TJ) |
balíček / pouzdro: | 900-BBGA, FCBGA |
dodavatelský balíček zařízení: | 900-FCBGA (31x31) |
We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.
We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.
TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.
Copyright © 2024 ZHONG HAI SHENG TECHNOLOGY LIMITED All Rights Reserved.
Prohlášení o ochraně soukromí | Podmínky použití | Záruka kvality